تحلیل تاثیرپذیری الکترومغناطیسی خطوط ریزنوار ابررسانا در تابش مایل

[1]R. Cicchetti, O. Testa, D. Caratelli, “A numerical procedure for the analysis of EMC/EMI problems in radio communication systems operating in complex environments,” IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 6, pp. 1269-1280, Dec. 2012.##

[2]Y. Jiang, Y. Ding, and Y. Xie, “Development of an effective feed-forward control method for active antenna cancelation,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 5, pp. 973-981, Oct. 2015.##

 [3]G. Lugrin, S. V. Tkachenko, F. Rachidi, M. Rubinstein, and R. Cherkaoui, “High-frequency electromagnetic coupling to multiconductor transmission lines of finite length,” IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 6, pp. 1714-1723, Dec. 2015.## 

[4]Periyasamy M. Mariappan, Dhanasekaran R. Raghavan, Shady H. E. Abdel Aleem, and A. F. Zobaa, “Effects of electromagnetic interference on the functional usage of medical equipment by 2G/3G/4G cellular phones: A review,” Journal of Advanced Research, vol. 7, no. 5, pp. 727-738, Sep. 2016.##

[5] H. Qin, F. He, J. Meng, and Q. Wang, “Analysis and optimal design of radio-frequency interference adaptive cancellation system with delay mismatch,” IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 6, pp. 2015-2023, Dec. 2019.##

[6]M. Leone and H. L. Singer, “On the coupling of an external electromagnetic field to a printed circuit board trace,” IEEE Transactions on Electromagnetic Compatibility, vol. 41, no. 4, pp. 418-424, Nov. 1999.##

[7] M. Leone, “Radiated susceptibility on the            printed-circuit-board level: simulation and measurement,” IEEE Transactions on Electromagnetic Compatibility, vol. 47, no. 3, pp. 471-478, Aug. 2005.##

[8]B. W. -. Wong and A. Cantoni, “Modeling and analysis of radiated emissions and signal integrity of capacitively loaded printed circuit board interconnections,” IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 5, pp. 1087-1096, Oct. 2012.##

[9]H. Shall, Z. Riah, and M. Kadi, “A novel approach for modeling near-field coupling with pcb traces,” IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 5, pp. 1194-1201, Oct. 2014.##

[10] G. P. Veropoulos, P. J. Papakanellos, and C. Vlachos, “A probabilistic approach for the susceptibility assessment of a straight pcb trace excited by random plane-wave fields,” IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 1, pp. 258-265, Feb. 2018.##

[11]J. S. Hong, E. P. McErlean, and B. M. Karyamapudi, “A high-temperature superconducting filter for future mobile telecommunication systems,” IEEE Transactions on Microwave Theory and Techniques, vol. 53, no. 6, pp. 1976-1981, June 2005.##

[12]M. J. Lancaster, “Passive microwave device applications of high-temperature superconductors,” Cambridge University Press, 2006.##

[13] M. H. Devoret and R. J. Schoelkopf, “Superconducting Circuits for Quantum Information: An Outlook,” Science, vol. 339, p. 1169, 2013.##

[14] M. H. Amini and A. Mallahzadeh, “Analyzing radiated susceptibility of superconducting microstrip transmission line under plane wave excitation,” IEEE Transactions on Electromagnetic Compatibility, to be published. DOI: 10.1109/TEMC.2019.2958815.##

[15] D. M.  Pozar, “Radiation and scattering from a microstrip on uniaxial substrate,” IEEE Transactions on Antennas and Propagation, vol. 35, no. 6, pp.    613-621, Jun. 1987.##